发明申请
US20040224179A1 Laser peening method and apparatus using tailored laser beam spot sizes
审中-公开
激光喷丸处理方法和设备采用定制的激光束斑点尺寸
- 专利标题: Laser peening method and apparatus using tailored laser beam spot sizes
- 专利标题(中): 激光喷丸处理方法和设备采用定制的激光束斑点尺寸
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申请号: US10434621申请日: 2003-05-09
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公开(公告)号: US20040224179A1公开(公告)日: 2004-11-11
- 发明人: David W. Sokol , Allan H. Clauer
- 申请人: LSP Technologies, Inc.
- 申请人地址: null
- 专利权人: LSP Technologies, Inc.
- 当前专利权人: LSP Technologies, Inc.
- 当前专利权人地址: null
- 主分类号: B23K026/00
- IPC分类号: B23K026/00 ; B32B007/10
摘要:
A laser shock processing treatment enables a selectively adjustable and customized compressive residual stress distribution profile to be developed within a workpiece by tailoring the size and shape of the laser beam spots. One peening operation applies to the workpiece a first pattern having relatively large laser beam spots and then applies a second pattern having relatively small laser beam spots. The composite use of such small and large beam spots enables the stress distribution profile to be tailored to the part specifications. The large beam spots maximize the depth of compressive residual stress in the part, while the small beam spots optimize the surface compressive residual stresses of the part. The use of small spot beam patterns allows untreated or improperly processed areas to be laser peened.
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