发明申请
- 专利标题: Gas delivery system for semiconductor processing
- 专利标题(中): 用于半导体加工的气体输送系统
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申请号: US10825831申请日: 2004-04-16
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公开(公告)号: US20040231798A1公开(公告)日: 2004-11-25
- 发明人: Sudhir Gondhalekar , Padmanabhan Krishnaraj , Tom K. Cho , Muhammad Rasheed , Hemant Mungekar , Thanh N. Pham , Zhong Qiang Hua
- 申请人: Applied Materials, Inc.
- 申请人地址: null
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: null
- 主分类号: C23F001/00
- IPC分类号: C23F001/00
摘要:
A replaceable gas nozzle is insertable in a gas distributor ring of a substrate processing chamber and that can be shielded within the chamber. The replaceable gas nozzle has a longitudinal ceramic body having a channel to direct the flow of the gas into the chamber. The ceramic body includes a first external thread to mate with the gas distributor ring, and a second external thread to receive a heat shield. The channel has an inlet to receive the gas from the gas distributor ring and a pinhole outlet to release the gas into the chamber. A heat shield can be used to shield the nozzle extending into the chamber. The heat shield has a hollow member configured to be coupled with the nozzle that has an internal dimension sufficiently large to be disposed around at least a portion of the nozzle. The hollow member also has an extension which projects distally of the outlet of the nozzle and a heat shield opening for the process gas to flow therethrough from the nozzle outlet.
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