Invention Application
- Patent Title: Work piece holding apparatus, work piece illumination apparatus and work piece inspection system
- Patent Title (中): 工件夹持装置,工件照明装置和工件检查系统
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Application No.: US10834346Application Date: 2004-04-29
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Publication No.: US20040240197A1Publication Date: 2004-12-02
- Inventor: Yoshihiko Miyakawa , Hidetoshi Suzuki , Hiroshi Wakabayashi , Hitoshi Nakayama , Akimasa Nakao
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2003-150361 20030528
- Main IPC: F21V033/00
- IPC: F21V033/00

Abstract:
The present invention relates to an electronic part holding apparatus used for an FPC bonding apparatus or the like. An object of the present invention is to provide the structure including an illumination apparatus used for image detection that can illuminate a predetermined area stably and uniformly. To attain that object, in the holding apparatus having functions of holding and illuminating a work piece, the holding position and the illumination position are made different, and the deformation of the work piece is made possible at the illumination position.
Public/Granted literature
- US07192150B2 Work piece holding apparatus, work piece illumination apparatus and work piece inspection system Public/Granted day:2007-03-20
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