Invention Application
- Patent Title: Sliding member
- Patent Title (中): 滑动构件
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Application No.: US10854261Application Date: 2004-05-27
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Publication No.: US20040241489A1Publication Date: 2004-12-02
- Inventor: Toshiaki Kawachi , Hideo Ishikawa , Masaaki Sakamoto
- Applicant: Daido Metal Company Ltd.
- Applicant Address: JP Nagoya
- Assignee: Daido Metal Company Ltd.
- Current Assignee: Daido Metal Company Ltd.
- Current Assignee Address: JP Nagoya
- Priority: JP2003-153153 20030529
- Main IPC: B32B015/01
- IPC: B32B015/01
Abstract:
Disclosed is a sliding member including an overlay layer made of a Bi based alloy comprising Cu as an essential element and at least one element selected from the group of Sn and In, wherein the Bi based alloy comprises 0.1 to 10 mass % of Cu and 0.5 to 10 mass % in total of the at least one element selected from the group of Sn and In.
Public/Granted literature
- US07128981B2 Sliding member Public/Granted day:2006-10-31
Information query
