Invention Application
- Patent Title: Heat-activated electrical coupling for in situ circuit reconfiguration
- Patent Title (中): 用于原位电路重构的热激电耦合
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Application No.: US10456223Application Date: 2003-06-06
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Publication No.: US20040245242A1Publication Date: 2004-12-09
- Inventor: Daniel J. Byrne , Amol S. Pandit , Mark N. Robins
- Main IPC: H05B001/02
- IPC: H05B001/02

Abstract:
The present invention in situ reconfigures connections within an electric circuit, such that a previously open circuit becomes a permanent in situ electrical pathway. A heat-activated electrical coupling comprises a heat-activated coupler and a heater. The heat-activated coupler comprises a preform of a material that changes a physical or electrical state in response to heat from the heater to bridge a gap between separate but adjacent ends of respective circuit traces. An in situ reconfigurable circuit comprises the heat-activated electrical coupling, a fusible link, a primary circuit and a secondary or back-up circuit. An in situ recoverable electrostatic discharge (ESD) circuit comprises the heat-activated electrical coupling, a primary ESD protection portion, and a secondary or back-up ESD protection portion. A method of in situ reconfiguring a circuit comprises creating the heat-activated electrical coupling and activating the electrical coupling with heat.
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