Invention Application
US20050017374A1 Semiconductor component of semiconductor chip size with flip-chip-like external contacts, and method of producing the same
有权
具有倒装芯片状外部接点的半导体芯片尺寸的半导体元件及其制造方法
- Patent Title: Semiconductor component of semiconductor chip size with flip-chip-like external contacts, and method of producing the same
- Patent Title (中): 具有倒装芯片状外部接点的半导体芯片尺寸的半导体元件及其制造方法
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Application No.: US10896993Application Date: 2004-07-23
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Publication No.: US20050017374A1Publication Date: 2005-01-27
- Inventor: Helmut Kiendl , Horst Theuss , Michael Weber
- Applicant: Helmut Kiendl , Horst Theuss , Michael Weber
- Priority: DE10333841.1 20030724
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/31 ; H01L23/48 ; H01L21/44
Abstract:
A semiconductor component and a method for its production in semiconductor chip size, can have a semiconductor chip, which has external contacts of the semiconductor component that are arranged in the manner of a flip-chip on its active upper side. The semiconductor chip can be encapsulated by a plastic compound at least on its rear side and its side edges. The outer contacts, which can be arranged on external contact connecting areas, can project from the active upper side.
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Information query
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