发明申请
- 专利标题： Module part
- 专利标题（中）： 模块部分
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申请号： US10488552申请日： 2003-02-19
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公开(公告)号： US20050017740A1公开(公告)日： 2005-01-27
- 发明人: Hiroshi Higashitani , Takeo Yasuho , Masaaki Hayama
- 申请人： Hiroshi Higashitani , Takeo Yasuho , Masaaki Hayama
- 优先权： JP2002-41066 20020219
- 国际申请： PCT/JP03/01785 WO 20030219
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L21/56 ; H01L23/498 ; H01L23/538 ; H01L25/065 ; H05K1/18 ; H05K3/46 ; G01R31/02
摘要：
A module component which includes circuit substrate 3 having one or more components 1 on at least one of the surfaces, and junction circuit substrate 5 having hollow 4, or hole, disposed corresponding to the portion of the one or more components 1 mounted on the one surface of circuit substrate 3 for fitting the mounted components 1 in. These substrates are laminated to form a single body so that mounted components 1 is contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.
公开/授权文献
- US07161371B2 Module part 公开/授权日：2007-01-09
信息查询
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