Invention Application
- Patent Title: Strength-enhanced, lightweight lignocellulosic composite board materials and methods of their manufacture
- Patent Title (中): 强度增强，轻质的木质纤维复合板材料及其制造方法
-
Application No.: US10619449Application Date: 2003-07-16
-
Publication No.: US20050019548A1Publication Date: 2005-01-27
- Inventor: Feipeng Liu , Brian Peek , Kelly Flaherty
- Applicant: Feipeng Liu , Brian Peek , Kelly Flaherty
- Applicant Address: US NJ Edison
- Assignee: J. M. Huber Corporation
- Current Assignee: J. M. Huber Corporation
- Current Assignee Address: US NJ Edison
- Main IPC: B27N3/00
- IPC: B27N3/00 ; B27N3/04 ; B32B21/00 ; B32B27/04 ; B32B27/18 ; C08L97/02 ; B32B3/00 ; B32B3/26 ; B32B21/02 ; C08J5/10
Abstract:
Lighweight lignocellulosic board materials, such as oriented strand board and others, having reduced densities while maintaining suitable mechanical properties, and methods for their manufacture.
Public/Granted literature
- US07217458B2 Strength-enhanced, lightweight lignocellulosic composite board materials and methods of their manufacture Public/Granted day:2007-05-15
Information query
