Invention Application
- Patent Title: Interlaced protocol for smart card application development
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Application No.: US10919727Application Date: 2004-08-16
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Publication No.: US20050022169A1Publication Date: 2005-01-27
- Inventor: Eric Perlin , Vinay Deo , David Milstein , Gilad Odinak , Scott Guthery , Klaus Schutz
- Applicant: Eric Perlin , Vinay Deo , David Milstein , Gilad Odinak , Scott Guthery , Klaus Schutz
- Applicant Address: US WA Redmond
- Assignee: Microsoft Corporation
- Current Assignee: Microsoft Corporation
- Current Assignee Address: US WA Redmond
- Main IPC: G06F11/36
- IPC: G06F11/36 ; G06F9/44
Abstract:
An integrated circuit (IC) card is presented comprising an input/output (I/O) interface and a smart card development interface (SCDI), coupled to the I/O interface, to receive and identify debug frames interlaced within a normal communication flow between the IC card and a host system.
Public/Granted literature
- US07516444B2 Interlaced protocol for smart card application development Public/Granted day:2009-04-07
Information query
