- 专利标题： Interlaced protocol for smart card application development
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申请号： US10919727申请日： 2004-08-16
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公开(公告)号： US20050022169A1公开(公告)日： 2005-01-27
- 发明人: Eric Perlin , Vinay Deo , David Milstein , Gilad Odinak , Scott Guthery , Klaus Schutz
- 申请人： Eric Perlin , Vinay Deo , David Milstein , Gilad Odinak , Scott Guthery , Klaus Schutz
- 申请人地址： US WA Redmond
- 专利权人： Microsoft Corporation
- 当前专利权人： Microsoft Corporation
- 当前专利权人地址： US WA Redmond
- 主分类号： G06F11/36
- IPC分类号： G06F11/36 ; G06F9/44
摘要：
An integrated circuit (IC) card is presented comprising an input/output (I/O) interface and a smart card development interface (SCDI), coupled to the I/O interface, to receive and identify debug frames interlaced within a normal communication flow between the IC card and a host system.
公开/授权文献
- US07516444B2 Interlaced protocol for smart card application development 公开/授权日：2009-04-07
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