发明申请
US20050023646A1 Multi-layered structure including an epitaxial layer having a low dislocation defect density, semiconductor device comprising the same, and method of fabricating the semiconductor device
有权
包括具有低位错缺陷密度的外延层的多层结构以及包含该外延层的半导体器件以及制造该半导体器件的方法
- 专利标题: Multi-layered structure including an epitaxial layer having a low dislocation defect density, semiconductor device comprising the same, and method of fabricating the semiconductor device
- 专利标题(中): 包括具有低位错缺陷密度的外延层的多层结构以及包含该外延层的半导体器件以及制造该半导体器件的方法
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申请号: US10851336申请日: 2004-05-24
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公开(公告)号: US20050023646A1公开(公告)日: 2005-02-03
- 发明人: Ho Lee , Moon-Han Park , Hwa-Sung Rhee , Jae-Yoon Yoo , Seung-Hwan Lee
- 申请人: Ho Lee , Moon-Han Park , Hwa-Sung Rhee , Jae-Yoon Yoo , Seung-Hwan Lee
- 优先权: KR2003-52897 20030730
- 主分类号: H01L21/20
- IPC分类号: H01L21/20 ; H01L21/8238 ; H01L31/072 ; H01L31/117
摘要:
A multi-layered structure of a semiconducotr device includes a substrate, and a heteroepitaxial layer having a low dislocation defect density on the substrate. The heteroepitaxial layer consists of a main epitaxial layer and at least one intermediate epitaxial layer sandwished in the main epitaxial layer. At their interface, the heteroepitaxial layer, i.e., the bottom portion of the main epitaxial layer, and the substrate have different lattice constants. Also, the intermediate epitaxial layer has a different lattice constant from that of the portions of the main epitaxial layer contiguous to the intermediate epitaxial layer. The intermediate epitaxial layer also has a thickness smaller than the net thickness of the main epitaxial layer such that the intermediate epitaxial layer absorbs the strain in the heteroepitaxial layer. Thus, it is possible to obtain a multi-layered structure comprising an epitaxial layer that is relatively thin and has a low dislocation defect density.
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