发明申请
US20050023653A1 Integrated circuit device having reduced bow and method for making same
有权
具有减少弓的集成电路装置及其制造方法
- 专利标题： Integrated circuit device having reduced bow and method for making same
- 专利标题（中）： 具有减少弓的集成电路装置及其制造方法
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申请号： US10931369申请日： 2004-08-31
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公开(公告)号： US20050023653A1公开(公告)日： 2005-02-03
- 发明人: William Tandy , Matt Schwab , Cary Baerlocher
- 申请人： William Tandy , Matt Schwab , Cary Baerlocher
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/498 ; H01L23/495
摘要：
An integrated circuit device includes a semiconductor component coupled with a lead frame, and an integrated circuit package encompassing at least a portion of the semiconductor component. The package has a first surface and a second surface, and side surfaces, where the first surface is opposite the second surface. A parting line of the integrated circuit package is offset toward the second surface of the package, where the first surface optionally comprises the bottom surface of the package. The first surface of the package has one or more recessed areas.
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