The electronic component, comprises an integrated circuit incorporating several separate functional blocks within a semiconductor substrate, and electrostatic discharge protection means. These electrostatic discharge protection means comprise several separate metal discharge rails (GNDi) placed above the substrate (SB) and respectively associated with the plurality of functional blocks (CRi), all these metal discharge rails being mutually unconnected electrically within the integrated circuit (CI) but connected electrically via an electrical connection (FLi) external to the integrated circuit to one and the same ground plane (SLG) forming a ground reference for the electrostatic discharges, this ground plane (SLG) being located outside the integrated circuit (CI), and possibly being a heat slug.