Invention Application
- Patent Title: Structure of connector for reducing electro-magnetic wave interference
- Patent Title (中): 用于减少电磁波干扰的连接器结构
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Application No.: US10876455Application Date: 2004-06-28
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Publication No.: US20050026509A1Publication Date: 2005-02-03
- Inventor: Chih-Kai Chang
- Applicant: Chih-Kai Chang
- Applicant Address: TW Taoyuan Hsien
- Assignee: SPEED TECH CORP.
- Current Assignee: SPEED TECH CORP.
- Current Assignee Address: TW Taoyuan Hsien
- Priority: TW092213862 20030730
- Main IPC: H01R13/719
- IPC: H01R13/719 ; H01R13/648
Abstract:
A structure of a connector is provided. The connector comprises a receiving module, a first circuit board, a second circuit board, a third circuit board and adaptor module. The circuits of various characteristics are set onto the first circuit board and the second circuit board respectively for reducing electro-magnetic wave inferences during signal transmission.
Public/Granted literature
- US07025635B2 Structure of connector for reducing electro-magnetic wave interference Public/Granted day:2006-04-11
Information query
