发明申请
- 专利标题： Module with embedded semiconductor IC and method of fabricating the module
- 专利标题（中）： 带嵌入式半导体IC的模块及其制造方法
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申请号： US10900458申请日： 2004-07-28
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公开(公告)号： US20050029642A1公开(公告)日： 2005-02-10
- 发明人: Minoru Takaya , Hisayuki Abe , Kei Suzuki , Kosuke Takano , Kenichi Kawabata , Toshikazu Endo
- 申请人： Minoru Takaya , Hisayuki Abe , Kei Suzuki , Kosuke Takano , Kenichi Kawabata , Toshikazu Endo
- 优先权： JP2003-283243 20030730; JP2004-191369 20040629; JP2004-191475 20040629
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/538 ; H05K1/18 ; H01L23/02
摘要：
A module with embedded semiconductor IC of the present invention includes a first resin layer, a second resin layer, post electrodes passing through the first and second resin layers, and a semiconductor IC mounted as embedded between the first resin layer and the second resin layer. Stud bumps are formed on land electrodes of the semiconductor IC and positioned with respect to the post electrodes. Owing to this positioning of the stud bumps formed on the semiconductor IC with respect to the post electrodes, the planar position of the stud bumps is substantially fixed. As a result, it is possible to use a semiconductor IC having a very narrow electrode pitch of 100 μm or smaller, particularly of around 60 μm.
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