发明申请
- 专利标题： Method of characterization, method of characterizing a process operation, and device manufacturing method
- 专利标题（中）： 表征方法，表征工艺操作的方法以及器件制造方法
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申请号： US10844572申请日： 2004-05-13
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公开(公告)号： US20050031975A1公开(公告)日： 2005-02-10
- 发明人: Maria Reuhman-Huisken , Christianus De Mol , Hoite Tolsma
- 申请人： Maria Reuhman-Huisken , Christianus De Mol , Hoite Tolsma
- 申请人地址： NL Veldhoven
- 专利权人： ASML Netherlands B. V.
- 当前专利权人： ASML Netherlands B. V.
- 当前专利权人地址： NL Veldhoven
- 优先权： EP03252966.1 20030513
- 主分类号： G03F9/00
- IPC分类号： G03F9/00 ; G03F7/20 ; H01L21/027 ; G03F7/00
摘要：
A system in which deformation of a substrate wafer is monitored during processing of the wafer is disclosed. In one embodiment, the distortion in the substrate wafer is measured after each exposure and processing operation by comparing the position of a plurality of reference marks to values in a database.
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