发明申请
- 专利标题： Method for processing a semiconductor wafer
- 专利标题（中）： 半导体晶片的处理方法
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申请号： US10941346申请日： 2004-09-14
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公开(公告)号： US20050032391A1公开(公告)日： 2005-02-10
- 发明人: Steven L. Peace , Gary Curtis , Raymon Thompson , Brian Aegerter , Curt Dundas
- 申请人： Steven L. Peace , Gary Curtis , Raymon Thompson , Brian Aegerter , Curt Dundas
- 专利权人： Semitool, Inc.
- 当前专利权人： Semitool, Inc.
- 主分类号： H01L21/306
- IPC分类号： H01L21/306 ; B08B3/04 ; H01L21/00 ; H01L21/3213 ; H01L21/302 ; H01L21/461
摘要：
An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.
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