发明申请
- 专利标题: Method for manufacturing semiconductor device
- 专利标题(中): 制造半导体器件的方法
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申请号: US10952774申请日: 2004-09-30
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公开(公告)号: US20050040402A1公开(公告)日: 2005-02-24
- 发明人: Hisashi Ohtani , Akiharu Miyanaga , Hongyong Zhang , Naoaki Yamaguchi
- 申请人: Hisashi Ohtani , Akiharu Miyanaga , Hongyong Zhang , Naoaki Yamaguchi
- 申请人地址: JP Atsugi-shi 243-0036
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP Atsugi-shi 243-0036
- 优先权: JP6-51237 19940223
- 主分类号: H01L21/20
- IPC分类号: H01L21/20 ; H01L21/336 ; H01L21/77 ; H01L21/84 ; H01L29/10 ; H01L27/12
摘要:
[Purpose] It is an object to obtain a crystalline silicon film having preferable characteristics for a thin film transistor. [Structure] A crystalline silicon film having improved crystallinity is obtained by the following steps: forming a silicon nitride film substantially in contact with an amorphous silicon film on glass substrate; introducing a catalyst element such as nickel; performing an annealing treatment at a temperature of 500 to 600° C. for crystallization; and further irradiating it with a laser light, thereby a crystalline silicon film having improved crystallinity can be obtained. By using the crystalline silicon film thus obtained, a semiconductor device such as a TFT having improved characteristic can be obtained.
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