An improved process for fabricating an electrically conductive shaped article is disclosed. The process includes one or more process stages selected from the group consisting of: preparing one or more feeds of the plastic and fillers; feeding the plastic and fillers to a melt compounding stage wherein a homogeneous melt of the composition is obtained; transferring the homogeneous melt ; and subjecting the homogeneous melt to a moulding process to produce the conductive shaped article. One or more of the process stages is conducted under low shear strain conditions so that the article has a through-plane resistivity of less than about 600 μOhm-m. Also disclosed are the conductive plates having improved performance properties such as flexural strength, conductivity and surface smoothness.