发明申请
US20050042804A1 Method for fabricating surface acoustic wave filter packages and package sheet used therein
失效
制造表面声波滤波器封装及其中使用的封装片的方法
- 专利标题： Method for fabricating surface acoustic wave filter packages and package sheet used therein
- 专利标题（中）： 制造表面声波滤波器封装及其中使用的封装片的方法
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申请号： US10713028申请日： 2003-11-17
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公开(公告)号： US20050042804A1公开(公告)日： 2005-02-24
- 发明人: Tae Kim , Ju Seo , Joo Park , Moon Jeon
- 申请人： Tae Kim , Ju Seo , Joo Park , Moon Jeon
- 优先权： KR2003-57496 20030820
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/44 ; H03H3/08 ; H03H9/10
摘要：
Disclosed is a method for fabricating Surface Acoustic Wave filter packages using a package sheet having an outline pattern and anti-bur holes and a package sheet used therein. In the package sheet for a Surface Acoustic Wave filter package, an outline pattern is formed along outer peripheries of predetermined areas to be mounted with a plurality of SAW filter chips. The outline pattern is contacted with a metal shield layer formed on the SAW filter chips and a predetermined region of the package sheet. Circular anti-bur holes cover the corners of the areas to be mounted with the SAW filter chips and are intersected by cutting lines functioning as reference lines for cutting the sheet into a plurality of SAW filter packages.
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