发明申请
- 专利标题： Removing sacrificial material by thermal decomposition
- 专利标题（中）： 通过热分解去除牺牲材料
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申请号： US10953744申请日： 2004-09-29
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公开(公告)号： US20050042874A1公开(公告)日： 2005-02-24
- 发明人: Robert Meagley , Peter Moon , Kevin O'Brien
- 申请人： Robert Meagley , Peter Moon , Kevin O'Brien
- 主分类号： H01L21/768
- IPC分类号： H01L21/768 ; H01L21/302 ; H01L21/461
摘要：
A thermally decomposable sacrificial material is deposited in a void or opening in a dielectric layer on a semiconductor substrate. The thermally decomposable sacrificial material may be removed without damaging or removing the dielectric layer. The thermally decomposable sacrificial material may be a combination of organic and inorganic materials, such as a hydrocarbon-siloxane polymer hybrid.
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