发明申请
- 专利标题： Contact assemblies for electrochemical processing of microelectronic workpieces and method of making thereof
- 专利标题（中）： 微电子工件电化学处理接触组件及其制造方法
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申请号： US10497670申请日： 2002-12-05
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公开(公告)号： US20050045474A1公开(公告)日： 2005-03-03
- 发明人: Nolan Zimmerman , Gregory Wilson , Steve Eudy
- 申请人： Nolan Zimmerman , Gregory Wilson , Steve Eudy
- 优先权： US10/008,636 20011205
- 国际申请： PCT/US02/39244 WO 20021205
- 主分类号： C25D7/12
- IPC分类号： C25D7/12 ; C25D17/06
摘要：
Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assembly (400) can comprise a support member (410) that includes an inner wall (412) which defines an opening (414) configured to receive the work-piece and a plurality of contacts (420). The individual contacts (420) include a conductor (440) and a cover (430). The conductor (440) can comprise a proximal section (435) projecting inwardly into the opening (414) relative to the support member (410), a distal section (436) extending from the proximal section (435), and an inert exterior (444) at least at the distal section (436). The cover (430) comprises a dielectric element that covers at least the proximal section of the conductor, but does not cover at least a portion of the distal section of the core. The exposed portion of the distal section of the core, accordingly, defines a conductive contact site for contacting a conductive layer (e.g., a seed layer) on the workpiece.