发明申请
US20050048700A1 No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance
审中-公开
具有低热膨胀系数和良好焊球助熔性能的无流动底部填充材料
- 专利标题： No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance
- 专利标题（中）： 具有低热膨胀系数和良好焊球助熔性能的无流动底部填充材料
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申请号： US10653371申请日： 2003-09-02
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公开(公告)号： US20050048700A1公开(公告)日： 2005-03-03
- 发明人: Slawomir Rubinsztajn , Sandeep Tonapi , John Campbell , Ananth Prabhakumar
- 申请人： Slawomir Rubinsztajn , Sandeep Tonapi , John Campbell , Ananth Prabhakumar
- 主分类号： C08L63/00
- IPC分类号： C08L63/00 ; H01L21/56 ; H01L23/29 ; B32B27/38
摘要：
A no-flow underfill composition comprising an epoxy resin in combination with epoxy hardener and optional reagents and a filler of a functionalized colloidal silica having a particle size ranging from about 1 nm to about 250 nm. The colloidal silica is functionalized with at least one organoalkoxysilane functionalization agent and subsequently functionalized with at least one capping agent. The epoxy hardener includes anhydride curing agents. The optional reagents include cure catalyst and hydroxyl-containing monomer. The adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.
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