发明申请
- 专利标题： Integrated circuit card and a method of manufacturing the same
- 专利标题（中）： 集成电路卡及其制造方法
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申请号： US10902024申请日： 2004-07-30
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公开(公告)号： US20050052851A1公开(公告)日： 2005-03-10
- 发明人: Nobuaki Yamada , Kazunari Suzuki , Bunshi Kuratomi , Hiroaki Tanaka , Akira Onozawa
- 申请人： Nobuaki Yamada , Kazunari Suzuki , Bunshi Kuratomi , Hiroaki Tanaka , Akira Onozawa
- 优先权： JP2003-318099 20030910
- 主分类号： B42D15/10
- IPC分类号： B42D15/10 ; G06K19/077 ; H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L23/02 ; H04B1/38 ; H04M1/00 ; H05K1/14
摘要：
A multi-function structure of a plug-in universal IC card is to be promoted and the manufacturing cost is to be reduced. The body of the plug-in UICC is constructed of a molding resin. A tape substrate and a chip mounted on one side of the tape substrate are sealed in the interior of the molding resin. A side opposite to the chip mounting side of the tape substrate is exposed to the exterior of the molding resin and constitutes a surface portion of the plug-in UICC. Contact patterns serving as external terminals of the plug-in UICC are formed on the surface of the tape substrate exposed to the exterior of the molding resin. In the plug-in UICC whose body is constructed of molding resin, cracking of the chip can be prevented effectively even in the case where the chip is large-sized.
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