Invention Application
US20050053115A1 Thermal analyzer provided with cooling mechanism 有权
热分析仪配有冷却机构

  • Patent Title: Thermal analyzer provided with cooling mechanism
  • Patent Title (中): 热分析仪配有冷却机构
  • Application No.: US10929859
    Application Date: 2004-08-30
  • Publication No.: US20050053115A1
    Publication Date: 2005-03-10
  • Inventor: Shinya Nishimura
  • Applicant: Shinya Nishimura
  • Priority: JP2003-313086 20030904
  • Main IPC: G01N25/00
  • IPC: G01N25/00 G01K17/00 G01N25/48
Thermal analyzer provided with cooling mechanism
Abstract:
The present invention provides a thermal analyzer having a cooling device which can realize cooling of a specimen to a temperature equal to or below −100° C. by suppressing the consumption of gas also in performing rapid cooling. The cooling device includes a cooling gas inlet port and a cooling gas discharge port for a gas cooling device and an electric cooling device fixing mechanism, wherein the cooling device and the thermal analyzer are brought into thermal contact with each other. Due to such a constitution, it is possible to simultaneously connect the gas cooling device and the electric cooling device.
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