发明申请
US20050062118A1 Quantum efficiency enhancement for CMOS imaging sensor with borderless contact 有权
具有无边界接触的CMOS成像传感器的量子效率增强

Quantum efficiency enhancement for CMOS imaging sensor with borderless contact
摘要:
The present invention is a CMOS image sensor and its method of fabrication. This invention provides an efficient structure to improve the quantum efficiency of a CMOS image sensor with borderless contact. The image sensor comprises a N-well/P-substrate type photodiode with borderless contact and dielectric structure covering the photodiode region. The dielectric structure is located between the photodiode and the interlevel dielectric (ILD) and is used as a buffer layer for the borderless contact. The method of fabricating a high performance photodiode comprises forming a photodiode in the n-well region of a shallow trench, and embedding a dielectric material between the ILD oxide and the photodiode having a refraction index higher than the ILD oxide.
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