发明申请
- 专利标题: Apparatus and method for thermal processing of substrate
- 专利标题(中): 基板热处理装置及方法
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申请号: US10940095申请日: 2004-09-14
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公开(公告)号: US20050063448A1公开(公告)日: 2005-03-24
- 发明人: Tatsufumi Kusuda
- 申请人: Tatsufumi Kusuda
- 专利权人: Dainippon Screen Mfg. Co., Ltd.
- 当前专利权人: Dainippon Screen Mfg. Co., Ltd.
- 优先权: JP2003-325636 20030918
- 主分类号: C23C16/46
- IPC分类号: C23C16/46 ; H01L21/00 ; H01L21/26 ; H01L21/31 ; G01K19/00 ; C09K19/00 ; G01K15/00 ; G02F1/03
摘要:
A thermal processing apparatus (1) comprises a chamber body (6), a holding part (7) for holding a substrate (9) inside the chamber body (6), a light emitting part (5) for heating the substrate (9) through light irradiation and a light measuring part (2) for measuring light energy. The light measuring part (2) comprises a calorimeter (24) disposed outside the chamber body (6), a light guide structure (20) for guiding the light inside the chamber body (6) to the calorimeter (24) and a calculation part (25) for performing computations on the basis of an output of the calorimeter (24). In the thermal processing apparatus (1), by measuring the light from the light emitting part (5) by the calorimeter (24), it is possible to measure the energy of light emitted from the light emitting part (5) during thermal processing inside chamber body (6) and obtain a surface temperature of the substrate (9) by the calculation part (25).
公开/授权文献
- US07935913B2 Apparatus and method for thermal processing of substrate 公开/授权日:2011-05-03
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