发明申请
- 专利标题： Method for manufacturing an electronic circuit device and electronic circuit device
- 专利标题（中）： 电子电路装置及电子电路装置的制造方法
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申请号： US10901750申请日： 2004-07-29
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公开(公告)号： US20050064627A1公开(公告)日： 2005-03-24
- 发明人: Yuji Kimura , Takenobu Maeda , Toru Yabe
- 申请人： Yuji Kimura , Takenobu Maeda , Toru Yabe
- 专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人： Murata Manufacturing Co., Ltd.
- 优先权： JP2003-327055 20030919
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/485 ; H01L23/544 ; H05K1/02 ; H05K3/30 ; H05K3/40 ; H01L21/44 ; H01L21/48
摘要：
A circuit element having electrodes on one main surface thereof and a substrate having connection bump electrodes and recognition bump electrodes provided on one main surface thereof are prepared. Connection bumps and recognition bumps are formed on the connection bump electrodes and the recognition bump electrodes by using a wire bonding method. Based on the images of the recognition bumps picked up by an optical device, the location of the recognition bumps is detected and, based on the detected location, the circuit element is connected to the substrate through the connection bumps. Since the upper portions of the recognition bumps are in a convex shape, a contrast with respect to the recognition bump electrodes is easily obtained and the location of the recognition bumps can be correctly detected.
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