发明申请
- 专利标题： Encapsulation of electronic devices
- 专利标题（中）： 封装电子设备
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申请号： US10981980申请日： 2004-11-04
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公开(公告)号： US20050064780A1公开(公告)日： 2005-03-24
- 发明人: Mark Auch , Ewald Guenther , Lim Fang , Chua Jin
- 申请人： Mark Auch , Ewald Guenther , Lim Fang , Chua Jin
- 专利权人： Osram Opto Semiconductors GmbH, a German corporation,Institute of Materials Research and Engineering, a Singapore corporation
- 当前专利权人： Osram Opto Semiconductors GmbH, a German corporation,Institute of Materials Research and Engineering, a Singapore corporation
- 主分类号： H05B33/04
- IPC分类号： H05B33/04 ; H01L33/48 ; H01L51/50 ; H01L51/52 ; H05B33/10
摘要：
A method of encapsulating a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage. The spacer particles are fixed to one side of the substrate to prevent any movement.
公开/授权文献
- US07166007B2 Encapsulation of electronic devices 公开/授权日：2007-01-23
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