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Invention Application
US20050067290A1 Method and system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface 审中-公开
用于在衬底表面上金属镀覆期间自动控制多阳极布置的电流分布的方法和系统

  • Patent Title: Method and system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface
  • Patent Title (中): 用于在衬底表面上金属镀覆期间自动控制多阳极布置的电流分布的方法和系统
  • Application No.: US10861997
    Application Date: 2004-06-04
  • Publication No.: US20050067290A1
    Publication Date: 2005-03-31
  • Inventor: Matthias Bonkass , Dirk Wollstein , Axel Preusse
  • Applicant: Matthias Bonkass , Dirk Wollstein , Axel Preusse
  • Priority: DE10345376.8 20030930
  • Main IPC: C25D21/12
  • IPC: C25D21/12
Method and system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface
Abstract:
An electroplating tool is operated in combination with a controller which automatically determines the individual currents for a multi-anode configuration of the plating tool. The calculation of the anode currents may be based on sensitivity data and measurement data as well as on a desired target profile, so that a fast response with respect to process variations may be achieved even for a plating tool including a plurality of process chambers.
Abstract(Chinese):

电镀工具与控制器一起操作，控制器自动确定电镀工具的多阳极配置的各个电流。 阳极电流的计算可以基于灵敏度数据和测量数据以及期望的目标轮廓，使得即使对于包括多个处理室的电镀工具也可以实现关于工艺变化的快速响应。

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