发明申请
US20050070118A1 Fabrication process for preparing recording head sliders made from silicon substrates with SiO2 overcoats
有权
制备由SiO 2外涂层由硅衬底制成的记录头滑块的制造工艺
- 专利标题： Fabrication process for preparing recording head sliders made from silicon substrates with SiO2 overcoats
- 专利标题（中）： 制备由SiO 2外涂层由硅衬底制成的记录头滑块的制造工艺
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申请号： US10675203申请日： 2003-09-29
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公开(公告)号： US20050070118A1公开(公告)日： 2005-03-31
- 发明人: Nicholas Buchan , Timothy Reiley
- 申请人： Nicholas Buchan , Timothy Reiley
- 主分类号： G11B5/10
- IPC分类号： G11B5/10 ; H01L21/302 ; H01L21/461
摘要：
A method for fabricating recording head sliders made from silicon substrates, is described. A Silicon wafer with a SiO2 overcoat is provided, and a layer of material which is resistant to Deep Reactive Ion Etching (DRIE) is deposited on the SiO2 overcoat. A patterned layer of material which is resistant to Reactive Ion Etching (RIE) is deposited on the layer of DRIE-resistant material to form a primary mask. RIE is used through the primary mask to pattern the SiO2 overcoat layer and the layer of DRIE-resistant material. The primary mask is then removing to expose the layer of DRIE-resistant material which has now been patterned to form a secondary mask. DRIE is then used through the secondary mask to cut the Si wafer into pieces. Finally, the secondary mask is removed.