发明申请
- 专利标题: Heat transport device, semiconductor apparatus using the heat transport device and extra-atmospheric mobile unit using the heat transport device
- 专利标题(中): 热传输装置,使用热传输装置的半导体装置和使用热传输装置的大气外移动装置
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申请号: US10618657申请日: 2003-07-15
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公开(公告)号: US20050072559A1公开(公告)日: 2005-04-07
- 发明人: Shigetoshi Ippoushi , Tetsuro Ogushi , Kazushige Nakao , Hiroaki Ishikawa , Toshiyuki Umemoto , Hiroshi Chiba , Mihoko Shimoji
- 申请人: Shigetoshi Ippoushi , Tetsuro Ogushi , Kazushige Nakao , Hiroaki Ishikawa , Toshiyuki Umemoto , Hiroshi Chiba , Mihoko Shimoji
- 申请人地址: JP Tokyo
- 专利权人: Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人: Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址: JP Tokyo
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A heat transport device includes a container having a hollow structure including a fluid channel, at least one thermal-receiver heat exchanger and one thermal-radiator heat exchanger arranged side-by-side on an outer wall of the container along the fluid channel, and driving heat exchangers at respective terminal portions of the container. In this heat transport device, both ends of the fluid channel are closed to prevent intrusion of external air, and a liquid and a gas are sealed in the fluid channel. The driving heat exchangers cause the liquid to oscillate in the container along the internal fluid channel. The heat transport device provides low acoustic noise performance, improved temperature controllability, high heat transportation and heat radiating capacities, and improved heat transfer and fluid flow characteristics.
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