发明申请
- 专利标题： Package type semiconductor device
- 专利标题（中）： 封装型半导体器件
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申请号： US10959963申请日： 2004-10-08
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公开(公告)号： US20050077599A1公开(公告)日： 2005-04-14
- 发明人: Shoji Miura , Akihiro Niimi , Yoshimi Nakase , Takanori Teshima
- 申请人： Shoji Miura , Akihiro Niimi , Yoshimi Nakase , Takanori Teshima
- 专利权人： DENSO CORPORATION
- 当前专利权人： DENSO CORPORATION
- 优先权： JP2003-352508 20031010
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L21/3205 ; H01L21/336 ; H01L23/00 ; H01L23/29 ; H01L23/433 ; H01L23/482 ; H01L29/739 ; H01L29/78 ; H01L21/48 ; H01L29/40
摘要：
A package type semiconductor device comprising: a semiconductor chip having a semiconductor part; a main electrode for connecting to a first region of the semiconductor part; a control wiring layer for connecting to a second region of the semiconductor part; a blocking member electrically isolated from the control wiring layer; a first metallic layer; a protection film disposed among the main electrode, the control wiring layer and the blocking member; and a metal block for connecting to the main electrode through the first metallic layer. The chip, the main electrode, the control wiring layer, the blocking member, and the metal block are packaged. The blocking member is disposed between the main electrode and the control wiring layer.
公开/授权文献
- US07009292B2 Package type semiconductor device 公开/授权日：2006-03-07
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