Invention Application
US20050078466A1 Modularized circuit board mounting architecture 失效
模块化电路板安装架构

  • Patent Title: Modularized circuit board mounting architecture
  • Patent Title (中): 模块化电路板安装架构
  • Application No.: US10681992
    Application Date: 2003-10-08
  • Publication No.: US20050078466A1
    Publication Date: 2005-04-14
  • Inventor: Cheng-Chung Hsu
  • Applicant: Cheng-Chung Hsu
  • Main IPC: H05K7/14
  • IPC: H05K7/14
Modularized circuit board mounting architecture
Abstract:
A modularized circuit board mounting architecture is proposed, which is designed for use to mount a modularized circuit board onto the inside of an enclosure, such as a server's chassis or a desktop computer's casing. The proposed mounting architecture is more advantageous to use that prior art in that the mounting and dismounting of the modularized circuit board to and from the enclosure can be both carried out effortlessly simply by hand without requiring technical personnel or user to use any assisting tools, such as screw drivers. This feature allows computer manufacturers to assembly computer units more quickly and efficiently and thereby significantly reduce labor hours. Moreover, it also allows after-sale maintenance or upgrade to be carried out more quickly and efficiently.
Public/Granted literature
Information query
Patent Agency Ranking
0/0