发明申请
- 专利标题: Shielding assembly and method
- 专利标题(中): 屏蔽装配及方法
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申请号: US10682651申请日: 2003-10-09
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公开(公告)号: US20050078468A1公开(公告)日: 2005-04-14
- 发明人: WIlliam DiPoala
- 申请人: WIlliam DiPoala
- 主分类号: H05K9/00
- IPC分类号: H05K9/00
摘要:
A shielding assembly and method for use with an electromagnetic field generating source. The assembly includes an outer housing that includes a conductive material. The outer housing defines a chamber in which the field generating source is located. A polymeric inner body substantially fills the chamber. The inner body is spaced from and circumscribes the field generating source. The field generating source may be the resonant oscillator of a microwave transceiver circuit and the inner body may advantageously include between 2-10%, by weight, of a semiconductive filler such as carbon or graphite. A printed circuit board may be attached to the outer housing to define the chamber together with the outer housing. The inner body may be secured within the chamber by compressive engagement between the printed circuit board and outer housing. Spacing elements are used to provide a clearance gap between the printed circuit board and the inner body.
公开/授权文献
- US07009106B2 Shielding assembly and method 公开/授权日:2006-03-07