发明申请
US20050080204A1 Silicone resin composition, curable resin composition, and curable resin
有权
硅树脂组合物，可固化树脂组合物和可固化树脂
- 专利标题： Silicone resin composition, curable resin composition, and curable resin
- 专利标题（中）： 硅树脂组合物，可固化树脂组合物和可固化树脂
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申请号： US10504338申请日： 2003-02-14
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公开(公告)号： US20050080204A1公开(公告)日： 2005-04-14
- 发明人: Haruhiko Furukawa , Koji Nakanishi , Yoshitsugu Morita , Hiroshi Ueki
- 申请人： Haruhiko Furukawa , Koji Nakanishi , Yoshitsugu Morita , Hiroshi Ueki
- 优先权： JPNO.2002-54544 20020228
- 国际申请： PCT/JP03/01608 WO 20030214
- 主分类号： C08G77/14
- IPC分类号： C08G77/14 ; C08K5/00 ; C08L61/06 ; C08L63/00 ; C08L83/04 ; C08L83/06 ; C08L101/00
摘要：
The present invention relates to a silicone resin composition of low melt viscosity and excellent reactivity and dispersibility in organic resins. The present invention also relates to a curable resin composition for forming a cured resin of excellent moldability and superior flame retardant properties while having little adverse impact on the human body and the environment as a result of containing no antimony oxides or halogenated epoxy resins. The present invention also relates to a cured resin having little adverse impact on the human body or the environment and possessing superior flame retardant properties.