发明申请
US20050086615A1 Computer aided design method and apparatus for modeling and analyzing on-chip interconnect structures
失效
用于对片上互连结构进行建模和分析的计算机辅助设计方法和装置
- 专利标题： Computer aided design method and apparatus for modeling and analyzing on-chip interconnect structures
- 专利标题（中）： 用于对片上互连结构进行建模和分析的计算机辅助设计方法和装置
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申请号： US10690238申请日： 2003-10-21
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公开(公告)号： US20050086615A1公开(公告)日： 2005-04-21
- 发明人: Minakshisundaran Anand , Matthew Angyal , Alina Deutsch , Ibrahim Elfadel , Gerard Kopcsay , Barry Rubin , Howard Smith
- 申请人： Minakshisundaran Anand , Matthew Angyal , Alina Deutsch , Ibrahim Elfadel , Gerard Kopcsay , Barry Rubin , Howard Smith
- 主分类号： G06F9/455
- IPC分类号： G06F9/455 ; G06F17/50 ; G06F19/00 ; G06G7/62
摘要：
A computer aided design (CAD) system. A template generation engine generates templates from interconnect configuration files. A field solver generates high frequency passive element relationships from the templates. A circuit builder generates circuit description files from device technology models and from high frequency passive element relationships. Parameterized circuit description models may be generated for large range of sensitivity analyses. A simulator simulates circuit responses for transmission line models from the circuit description files. Interconnect configuration files may be generated by a geometry and material definition module that receives process description data from a designer.