发明申请
- 专利标题： No-flow underfill composition and method
- 专利标题（中）： 无流动底层填料的组成和方法
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申请号： US10692062申请日： 2003-10-23
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公开(公告)号： US20050087891A1公开(公告)日： 2005-04-28
- 发明人: Christopher Rumer , Tian-An Chen , Vijay Wakharkar , Paul Koning
- 申请人： Christopher Rumer , Tian-An Chen , Vijay Wakharkar , Paul Koning
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/60 ; H01L23/29
摘要：
In some embodiments, a method includes providing a composition which includes a base at least partially filled with filler particles and applying the composition as an underfill composition. At least some of the filler particles are electrically conductive.
公开/授权文献
- US06982492B2 No-flow underfill composition and method 公开/授权日：2006-01-03
信息查询
IPC分类:
