- 专利标题： Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts
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申请号： US10993866申请日： 2004-11-18
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公开(公告)号： US20050090125A1公开(公告)日： 2005-04-28
- 发明人: Kuljeet Singh , Kevin Wells , Julius Delino
- 申请人： Kuljeet Singh , Kevin Wells , Julius Delino
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H05K1/11 ; H01R12/00
摘要：
An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still allows for routing of traces between the contacts.
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