Invention Application
US20050091842A1 Manufacturing method of lead frame for optical coupling device as well as optical coupling device using this lead frame
有权
用于光耦合器件的引线框架的制造方法以及使用该引线框架的光耦合器件
- Patent Title: Manufacturing method of lead frame for optical coupling device as well as optical coupling device using this lead frame
- Patent Title (中): 用于光耦合器件的引线框架的制造方法以及使用该引线框架的光耦合器件
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Application No.: US10974910Application Date: 2004-10-28
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Publication No.: US20050091842A1Publication Date: 2005-05-05
- Inventor: Hideya Takakura , Kazuo Kusuda , Hiroyuki Shoji
- Applicant: Hideya Takakura , Kazuo Kusuda , Hiroyuki Shoji
- Assignee: Sharp Kabushiki kaisha
- Current Assignee: Sharp Kabushiki kaisha
- Priority: JP2003-370744 20031030
- Main IPC: H01L23/50
- IPC: H01L23/50 ; H01L21/48 ; H01L23/495 ; H01L25/16 ; H01L31/12 ; H01L31/18 ; H01R43/00

Abstract:
In a manufacturing method of a lead frame for an optical coupling device, the method includes the steps of preparing an elongated lead frame on which a plurality of tie bars are placed between a pair of side rails that are mutually in parallel with each other so as to orthogonally cross the bars, with a plurality of lead terminals being placed in a staggered form in a manner so as to orthogonally cross the tie bars, and laterally cutting the elongated lead frame to prepare a plurality of strap-shaped lead frames. Herein, the elongated lead frame is cut in such a manner that the length of protrusion of a cut end of each of the side rails from each of the tie bars is made longer than the length of protrusion of a lead terminal from each of the tie bars.
Public/Granted literature
- US07234231B2 Method of manufacturing a lead frame Public/Granted day:2007-06-26
Information query
IPC分类: