Invention Application
- Patent Title: Two-piece magnetic shield having improved heat dissipation
- Patent Title (中): 具有改善散热性能的两件式磁屏蔽
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Application No.: US10696431Application Date: 2003-10-29
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Publication No.: US20050094319A1Publication Date: 2005-05-05
- Inventor: Cherng-Chyi Han , Rod Lee , Mao-Min Chen , Pokang Wang
- Applicant: Cherng-Chyi Han , Rod Lee , Mao-Min Chen , Pokang Wang
- Assignee: Headway Technologies, Inc.
- Current Assignee: Headway Technologies, Inc.
- Main IPC: G11B5/127
- IPC: G11B5/127 ; G11B5/31 ; G11B5/33

Abstract:
Problems such as thermal pole tip protrusion result from thermal mismatch between the alumina and pole material during the writing process. This, and similar problems due to inadequate heat dissipation, have been overcome by dividing the bottom shield into two pieces both of which sit on top of a non-magnetic heat sink. Heat generated by the coil during writing is transferred to the non-magnetic heat sink whence it gets transferred to the substrate. With this approach, the head not only benefits from less field disturbance due to the small shield but also improves heat dissipation from the additional heat sink
Public/Granted literature
- US07320168B2 Method to improve heat dissipation in a magnetic shield Public/Granted day:2008-01-22
Information query
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