发明申请
- 专利标题: Wafer transfer apparatus
- 专利标题(中): 晶圆传送装置
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申请号: US10936478申请日: 2004-09-09
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公开(公告)号: US20050095111A1公开(公告)日: 2005-05-05
- 发明人: Ki-Sang Kim , Seung-Ki Chae , In-Ho Lee
- 申请人: Ki-Sang Kim , Seung-Ki Chae , In-Ho Lee
- 优先权: KR2003-76011 20031029
- 主分类号: H01L21/68
- IPC分类号: H01L21/68 ; B25J9/04 ; H01L21/677 ; B66C23/00
摘要:
A wafer transfer apparatus can transfer wafers to and from at least one process chamber quickly and in a small amount of space. The wafer transfer includes an arm unit, and a multi-blade connected to said arm unit so as to be rotatable relative to the arm unit. The multi-blade has at least two wafer supports configured to respectively support wafers as all lying in a horizontal plane. The arm unit includes a first arm mounted for rotation in a horizontal plane, and a second arm carried by the first arm and rotatable relative to the first arm in a horizontal plane. The multi-blade is carried by the second arm.
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