发明申请
- 专利标题： Quad flat flip chip packaging process and leadframe therefor
- 专利标题（中）： 四平面倒装芯片封装工艺及其引线框架
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申请号： US10967910申请日： 2004-10-18
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公开(公告)号： US20050101053A1公开(公告)日： 2005-05-12
- 发明人: Hsueh-Te Wang , Meng-Jen Wang , Chien Liu , Chi-Hao Chiu
- 申请人： Hsueh-Te Wang , Meng-Jen Wang , Chien Liu , Chi-Hao Chiu
- 优先权： TW92128658 20031016
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/495 ; H01L21/48
摘要：
A quad flat flip chip packaging process and a leadframe therefor are provided. A sacrificial film is attached on the leads of the leadframe for limiting the extent of bumps when formed and saving the manufacturing cost. Besides, the sacrificial film can be removed from the leadframe after a reflow step. Thus, the delamination between the molding compound material and the leads can be prevented during the molding step.
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