发明申请
- 专利标题： Epitaxially coated semiconductor wafer
- 专利标题（中）： 外延涂层半导体晶圆
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申请号： US11020947申请日： 2004-12-23
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公开(公告)号： US20050103261A1公开(公告)日： 2005-05-19
- 发明人: Wilfried Von Ammon , Ruediger Schmolke , Peter Storck , Wolfgang Siebert
- 申请人： Wilfried Von Ammon , Ruediger Schmolke , Peter Storck , Wolfgang Siebert
- 专利权人： WACKER SILTRONIC AG
- 当前专利权人： WACKER SILTRONIC AG
- 优先权： DE10211312.2 20020314
- 主分类号： C23C16/44
- IPC分类号： C23C16/44 ; C30B23/02 ; H01L21/205 ; H01L21/22 ; C30B1/00
摘要：
A process for epitaxially coating the front surface of a semiconductor wafer in a CVD reactor, the front surface of the semiconductor wafer being exposed to a process gas which contains a source gas and a carrier gas, and the back surface of the semiconductor wafer being exposed to a displacement gas, wherein the displacement gas contains no more than 5% by volume of hydrogen, with the result that diffusion of dopants out of the back surface of the semiconductor wafer, which is intensified by hydrogen, is substantially avoided. With this process, it is possible to produce a semiconductor wafer with a substrate resistivity of ≦100 mΩcm and a resistivity of the epitaxial layer of >1 Ωcm without back-surface coating, the epitaxial layer of which semiconductor wafer has a resistance inhomogeneity of
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