发明申请
US20050110163A1 Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same
失效
倒装芯片接合方法，用于提高倒装芯片封装工艺中的粘附力和金属层构造的基板结构
- 专利标题： Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same
- 专利标题（中）： 倒装芯片接合方法，用于提高倒装芯片封装工艺中的粘附力和金属层构造的基板结构
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申请号： US10964371申请日： 2004-10-13
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公开(公告)号： US20050110163A1公开(公告)日： 2005-05-26
- 发明人: Ja Koo , Hyoung Kim
- 申请人： Ja Koo , Hyoung Kim
- 优先权： KR2003-0083891 20031125
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/60 ; H01L23/48 ; H01L29/40
摘要：
A flip chip bonding method and substrate architecture are disclosed for enhancing bonding performance between a chip and a substrate by forming a bump on the chip or the substrate. The flip chip bonding method includes performing pretreatment of a wafer having chips, dicing, and obtaining the pretreated individual chip; performing pretreatment of a substrate; aligning the pads of the pretreated chip with the pads of the pretreated substrate, and bonding the chip and the substrate together by applying an ultrasonic wave and heat using a collet and simultaneously applying pressure. Post treatment is performed by filling or molding resin after bonding. The chip or the substrate is formed with a plated bump, a stud bump or a wedge bump. The stud bump or the wedge bump can be additionally formed on the plated bump.
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