- 专利标题： Storage structure with cleaved layer
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申请号： US10718137申请日： 2003-11-20
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公开(公告)号： US20050112846A1公开(公告)日： 2005-05-26
- 发明人: Neal Meyer , Andrew Van Brocklin , Peter Fricke , Warren Jackson , Kenneth Eldredge
- 申请人： Neal Meyer , Andrew Van Brocklin , Peter Fricke , Warren Jackson , Kenneth Eldredge
- 主分类号： H01L27/10
- IPC分类号： H01L27/10 ; H01L21/02 ; H01L21/20 ; H01L21/762 ; H01L21/8246 ; H01L27/105 ; H01L27/12 ; H01L21/8238 ; H01L21/30 ; H01L21/46
摘要：
Apparatus and method for making a multi-layered storage structure includes forming a device layer on a single-crystal wafer, cleaving the device layer from the wafer, repeating the forming and cleaving to provide a plurality of cleaved device layers, and bonding the cleaved device layers together to form the multi-layered storage structure.
公开/授权文献
- US06967149B2 Storage structure with cleaved layer 公开/授权日：2005-11-22
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