发明申请
- 专利标题： Roughened bonding pad and bonding wire surfaces for low pressure wire bonding
- 专利标题（中）： 用于低压引线接合的粗化焊盘和接合线表面
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申请号： US10722704申请日： 2003-11-25
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公开(公告)号： US20050112861A1公开(公告)日： 2005-05-26
- 发明人: John Fitzsimmons , Jeffrey Gambino , Erick Walton
- 申请人： John Fitzsimmons , Jeffrey Gambino , Erick Walton
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/44 ; H01L21/60 ; H01L23/485
摘要：
An intermediate semiconductor structure and method for low-pressure wire bonding that reduces the propensity of dielectric material to mechanical failure due to any wire bonding stresses. Roughened surfaces such as metal pillars or metal dendrites are provided on a bonding pad, bonding wire or both. These roughened surfaces increase reactivity between the bond wire and the bond pad to form strong bonds. This increased activity as a result of the roughened bonding pad and/or wire surfaces reduce the amount of pressure, temperature and energy required for wire bonding, which in turn, avoids damage to the bonding pad as well as the semiconductor substrate.