发明申请
- 专利标题： Stackable integrated circuit packaging
- 专利标题（中）： 可堆叠集成电路封装
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申请号： US10728324申请日： 2003-12-04
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公开(公告)号： US20050121764A1公开(公告)日： 2005-06-09
- 发明人: Debendra Mallik , Kinya Ichikawa , Terry Sterrett , Johanna Swan
- 申请人： Debendra Mallik , Kinya Ichikawa , Terry Sterrett , Johanna Swan
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L25/065 ; H01L25/10 ; H01L21/44 ; H01L23/48 ; H01L29/40
摘要：
A system may include an integrated circuit die, an integrated circuit package coupled to the integrated circuit die, mold compound in contact with the integrated circuit die and the integrated circuit package, and an interconnect coupled to the integrated circuit package. A first portion of the interconnect may be in contact with the mold compound, a second portion of the interconnect might not contact the mold compound, and a third portion of the interconnect may be in contact with the integrated circuit package.
公开/授权文献
- US07345361B2 Stackable integrated circuit packaging 公开/授权日：2008-03-18
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