发明申请
- 专利标题： Copper-based chip attach for chip-scale semiconductor packages
- 专利标题（中）： 铜芯片贴片芯片级半导体封装
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申请号： US11050234申请日： 2005-02-03
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公开(公告)号： US20050127498A1公开(公告)日： 2005-06-16
- 发明人: Masazumi Amagai , Akira Karashima
- 申请人： Masazumi Amagai , Akira Karashima
- 主分类号： H01L21/58
- IPC分类号： H01L21/58 ; H01L21/68 ; H01L23/31 ; H01L23/498 ; H01L23/34
摘要：
A semiconductor device comprising a semiconductor chip having an active and a passive surface, the passive surface adhesively attached to a substrate film by means of a multilayer composite; this composite comprising a metal foil having first and second surfaces and an adhesive layer attached on each of these surfaces. The multilayer composite has an average modulus larger than the modulus of the encapsulating molding compound used in the semiconductor device. By applying the composite to assembling face-up chip-scale devices, stress in solder joints is reduced and solder fatigue life enhanced.
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