发明申请
- 专利标题： Ultrafine-grain-copper-base sputter targets
- 专利标题（中）： 超细晶粒铜基溅射靶
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申请号： US11019713申请日： 2004-12-23
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公开(公告)号： US20050133125A1公开(公告)日： 2005-06-23
- 发明人: Andrew Perry , Paul Gilman
- 申请人： Andrew Perry , Paul Gilman
- 主分类号： C22F1/00
- IPC分类号： C22F1/00 ; C22F1/08 ; C23C14/34
摘要：
The sputter target has a composition selected from the group consisting of high-purity copper and copper-base alloys. The sputter target's grain structure is at least about 99 percent recrystallized; and the sputter target's face has a grain orientation ratio of at least about 10 percent each of (111), (200), (220) and (311). In addition, the sputter target has a grain size of less than about 10 μm for improving sputter uniformity and reducing sputter target arcing.
公开/授权文献
- US08025749B2 Ultrafine-grain-copper-base sputter targets 公开/授权日：2011-09-27
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